The company is now scaling up to deliver dozens of its scanning probe metrology systems per year. Nearfield founder Hamed Sadeghian foresees the Quadra metrology platform to be the basis for several products and product lines.
Nearfield is expecting to deliver its second product line based on the Quadra platform next year. This system will be able to image, non-destructively, subsurface structures with nano-precision.
In this talk, Hamed Sadeghian will highlight the major requirements for developing non-destructive 3D high-volume manufacturing metrology equipment in the semiconductor industry, the architecture of Quadra including software and the challenges faced and overcome. He will also address the impact of the system architecture on the outsourcing strategy to the high-tech supply chain. He is the founder of Jahesh Poulad Co.
Hamed was a principal scientist and Kruyt member of TNO and led a team of thirty researchers in nano-optomechatronic instrumentation at TNO in Delft from to However, the narrow power envelope of these battery-powered devices is often a significant obstacle in realizing rich application functionalities based on traditional neural networks.
Innatera employs a radically different approach to processing data efficiently at the sensor edge. This talk introduces the spiking neural processor and outlines how its neuromorphic architecture enables sub-milliwatt signal processing and pattern recognition at the sensor edge.
He was previously with Intel, where he worked with the Imaging and Camera Technologies Group developing domain-specific tools for the development of complex media processor architectures. He was also responsible for leading industry-focused research on power-efficient multiprocessors and computational neuroscience.
You want to stay ahead of your competitors by bringing the best product to the market, at the right time and at the right price point. Developing your own custom chip ASIC could be the best strategy for you. With one single-chip implementation, you could boost computational performance, massively cut power consumption and product size, and reduce unit cost.
Despite these obvious advantages, creating an ASIC is often perceived as a difficult process — with development cost and time as the main hurdles.
This talk will demonstrate that this perception is often no longer valid. As director of business development at Imec. IC-link, Bas Dorren will talk from his experience of managing many ASIC projects in a wide range of technologies for a large customer base worldwide.
He will explain what it takes to make an ASIC in terms of knowledge, cost and time. And he will make clear what the benefits could be for you. Bas Dorren spent more than 20 years in various technical and commercial roles of several semiconductor companies. More than 10 years ago, he joined Imec. Currently, he manages the business development activities. Sub-terahertz and terahertz THz waves have frequencies extending from 0.
These efforts require an interdisciplinary approach, with close interaction of high-frequency semiconductor technology for RF electronics but also including alternative approaches using photonic technologies.
The THz region also shows great promise for many application areas, ranging from imaging to spectroscopy and sensing. This talk will highlight the characteristics of channel propagation in this frequency region and present new results from channel measurements at GHz and GHz. Hands-on GaN Doherty amplifier design Although we have been developing RF power amplifiers for more than a decade, it does not grow old and the challenges remain.
This talk will take you through the paces of a Doherty amplifier development process with all its pitfalls and hurdles. Using newly developed GaN devices as example, the flow will be illustrated step by step, sharing experiences in designing these amplifiers for 5G basestation applications in the 3. He has more than four years of experience in developing Doherty amplifiers. He holds an MSc degree in electrical engineering from the University of Twente. Artificial intelligence that feels far from artificial.
Brain-inspired chips that respond as humans do. A groundbreaking chip that acts and reacts in real-time, ready for life. Last year, he assumed his current role. Recent advances in deep learning have transformed the way computing devices process human-centric content such as images, video, speech and audio. However, the AI technology available today has been designed primarily for cloud computing operations, a sector with considerably less constraints in terms of cost, power and scalability.
Our technology integrates a custom dataflow architecture with multicore in-memory computing, delivering extremely high performance — hundreds of TOPS — at very low wattage, with flexibility to support multiple networks.
In , he joined the Amsterdam-based emerging-technologies expert Bitfury to head its new AI venture. How can you truly implement AI-aided solutions on a day-to-day basis? Let us walk you through a successful case of deploying an AI system. Sounds easy: counting flies on a glue trap in a greenhouse. Complexity comes with all interacting components. Think: change management on daily ways of working, enabling a mobile camera to take pictures, data labeling, choosing the right image recognition algorithm, using the phone as an edge device, connecting to a cloud data lake, and creating an app to steer AI-driven actions.
His knowledge spans across digital transformations, infrastructure automation, data analytics, SRE, as well as horticulture, brewing, crypto and more. Affordable phased arrays, built using low-cost silicon chips, have become an essential technology for high-data-rate terrestrial 5G and satellite satcom systems because of their high gain, electronically steerable patterns, narrow beam widths, high tolerance to interference and adaptive nulling capabilities.
They have also become the backbone of all LEO and MEO satellites non-geostationary , both at the payload level and at the user terminal. High-EIRP, high-performance systems at X, Ku and Ka-bands and 60 GHz with analog and digital beamforming capabilities and with multiple beams are now available at low cost due to the immense commercial investments placed in the past 5 years.
This talk summarizes our work in this area and presents a roadmap for the future. All satcom affordable phased arrays are based on his work and architectures. To move quantum computers from the proof-of-principle stage towards real-life applications, many engineering challenges need to be overcome.
Amongst these are the generation and routing of control signals. As most of the platforms require signal frequencies between DC and 20 GHz, these challenges are for a large part RF engineering challenges.
The fundamentally sensitive nature of qubits drastically complicates these: qubits need to be placed at ultralow temperatures Jules van Oven holds a BSc and MSc degree in physics from Delft University of Technology where he graduated in the group of Lieven Vandersypen on the development of reflectometry setups to speed up the readout of spin qubits.
After graduation, he became the lead engineer of Innoseis, responsible for the development of a wireless sensor network for seismology applications. From , he rejoined Qutech as an electrical engineer, within the lab of Leonardo DiCarlo. He was part of the team that developed the Qutech Waveform Generator and the Central Controller, specifically designed for fault-tolerant quantum computing.
Throughout the years, he became the lead electronic engineer in the company, combining physics, material science and microwave engineering to realize products for quantum engineers.
Within Delft Circuits, he focuses on the design of integrated microwave components, intellectual property and strategic development to meet the needs of the quantum community. With the current roll-out of 5G telecommunication infrastructure systems and especially with the new massive MIMO architecture and the opening of the higher sub-6 GHz frequency bands, the RF power amplifier architecture and technology have gone through a major transformation.
The roll-out fueled and accelerated the technology developments and large advancements have been made at all levels such as power efficiency, linearity, bandwidth and integration. However, the next and future steps in 5G LTE networks, necessary to fulfil the growing demand of wireless communication, prove to be even more challenging.
This talk sketches the progress that has been made so far, as well as the future trends and challenges from an RF power amplifier point of view. Currently, he is working at Ampleon on technologies required for future RF power applications. Millimeter and sub-millimeter waves are nowadays being widely adopted within a variety of applications developed across the high-tech industry, including high-resolution automotive radar sensors, but also the fifth and sixth generation mobile communications RF front-ends.
These applications primarily consist of a system-in-package tightly integrated with radiating elements to ensure adequate electromagnetic performance.
Managing the design of such devices is particularly challenging from a manufacturing capabilities and related tolerances point of view, as the size of the metallic features shrinks with the frequency increase, but also due to the fact the power densities significantly increase, potentially leading to thermal issues. As such, RF IC package engineers not only need to accurately predict the electromagnetic performance of their implementation but also need to assess adequate thermal dissipation of these complex devices starting from early phases, driving their decisions towards the best system-in-package design sign-off.
This talk will showcase solutions aimed at addressing these multiphysics simulation needs. He initially worked as a circuit designer for specialized receivers with Ericsson and then joined Ansys in as a senior application engineer.
Developing innovative high-tech equipment is a daunting challenge, especially for startups and scale-ups. Solid systems engineering and lots of organizing are required when working with partners from different fields of expertise which is almost always the case. Generating new ideas and validating them in your next prototype can take a lot of time. And there is always the risk of drowning in specifications, procedures and organizational issues.
But your engineers want to engineer! The solution? Do it Agile! Surprisingly, an Agile approach with short development cycles will also work in high-tech development. The key is taking smaller steps, dividing the components into really small functional units, which can be either software, programmable logic, electronics or mechanics.
Next, project partners quickly build and develop these units in a parallel process or they can employ third parties such as prototyping services to do this. Finally, hardware and software units are integrated into a working prototype, ready to be tested. This way, the short cycles generate quick and frequent feedback on product feasibility. With an Agile approach to high-tech development, it becomes much easier to keep the focus on the technical development of the next prototype.
It allows all partners to concentrate on building the best possible components. This talk will highlight the advantages of Agile high-tech development, using as an example real-life cases, such as the development of crucial components for a multi-beam scanning electron microscope. Remco Jager is a project manager at Technolution Advance, a company that supports startups, scale-ups, and leading innovative manufacturers to bring advanced, innovative ideas to market quickly.
Building upon 18 years of experience with the development of solutions for the semiconductor industry, Jager realizes cutting-edge innovations for a wide range of customers in high tech. He has a broad and detailed technical understanding and a talent for creating overview and shaping processes.
The fast and ever-increasing demand for high-speed data services has been motivating and leading to define the next generation of telecommunication systems. To take advantage of this opportunity, methods and techniques to design RF and MW subsystems must continue to evolve to meet the requirements that include spectral and energy efficiency and, on the other hand, to reduce costs and time to market.
To deal with these challenges, important works have focused on modeling and simulating front-end designs to allow analysis and optimization at a system level. This talk will present a comprehensive methodology to extract a black-box model of a power amplifier for two application examples: the evaluation of linearization techniques and the front-end design of an advanced antenna system.
Wissam Saabe is an application engineer at Amcad Engineering. His research interests are non-linear analysis and behavioral modeling of RF and microwave circuits and subsystems.
This talk will discuss the architecture of state-of-the-art load pull measurement systems for 5G and 6G applications. It will highlight the challenges involved in characterizing devices, circuits and systems for next-generation wireless applications, which pose very stringent requirements in terms of in-band eg EVM and out-of-band eg ACPR distortion.
Application examples will be presented, including high-speed load pull for technology evaluations and power amplifier design, and modulated testing for 5G applications.
Finally, a procedure will be described for evaluating traceable uncertainty in load pull measurements. In , he joined the Electronics Research Laboratory at TU Delft where he carried out his PhD research on the development of advanced characterization setups for RF high-power and high-linearity amplifier design.
In , he co-founded and was appointed CEO of Anteverta, a company providing pioneering solutions in the fields of device characterization and high-performance power amplifier design. In , Anteverta was acquired and became part of Maury Microwave. His research interests include the development of advanced characterization setups for RF high-power and high-linearity amplifier design.
To transmit at these carrier frequencies, engineers use active antenna arrays with beam steering to overcome the high path loss. Testing and validating these actively steered antenna arrays and beam steering algorithms is complex and expensive, often involving large chambers and over-the-air OTA measurements.
This talk provides an overview of the different validation and test options for mm-wave active antenna array modules and related research and technology challenges. The first shapes the tiny tin, so the second can vaporize it into plasma. The plasma emits extreme ultraviolet EUV radiation that is focused into a beam and bounced through a series of mirrors. The mirrors are so smooth that if expanded to the size of Germany they would not have a bump higher than a millimeter.
Finally, the EUV beam hits a silicon wafer—itself a marvel of materials science—with a precision equivalent to shooting an arrow from Earth to hit an apple placed on the moon. This allows the EUV machine to draw transistors into the wafer with features measuring only five nanometers—approximately the length your fingernail grows in five seconds.
This wafer with billions or trillions of transistors is eventually made into computer chips. EUV lithography technology has been in development since the s but entered mass production only in the last two years. These companies include venerable firms such as Nikon and Canon. They have the experience, expertise, and market discipline that comes from decades of profitability in a competitive industry under extreme technological demands.
If these companies could make EUV machines, they would—it would make them billions of dollars. EUV machines are at the frontier of human technological capabilities.
China has virtually no lithography experience or industry. Any Chinese firm trying to develop EUV lithography would have to start from scratch. After false starts and delays, production of these machines is ramping up. Meanwhile, demand for more humdrum chips will also keep expanding as 5G mobile technology starts linking up cars and factories. The forecast implies earnings per share of 35 euros by , before share buybacks, JPMorgan analysts reckon. In other words, investors are paying a multiple of almost 20 times earnings a decade hence.
ASML is not immune to geopolitical tensions. That means more facilities, with more ASML machines.
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